W978H6KBVX2I TR

IC DRAM 256MBIT HSUL 12 134VFBGA
Mfr. Part Number
W978H6KBVX2I TR
Manufacturer
Winbond Electronics Corporation
Package / Case
134-VFBGA
Datasheet
Description
IC DRAM 256MBIT HSUL 12 134VFBGA
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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W978H6KBVX2I TR
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In Stock3,646
Unit
Price
$6.26
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Reference Price
QuantityPrice
1$ 6.2600
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-20 · Valid as reference until 2026-09-27 · Request RFQ for live stock.
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Specification Summary

Package / Case
134-VFBGA
Supplier Device Package
134-VFBGA (10x11.5)
Voltage - Supply
1.14V ~ 1.3V, 1.7V ~ 1.95V
Clock Frequency
400 MHz
Memory Format
DRAM
Memory Interface
HSUL_12
Memory Size
256Mb (16M x 16)
Memory Type
Volatile
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-20. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Memory Type
Volatile
Memory Format
DRAM
Technology
SDRAM - Mobile LPDDR2
Memory Interface
HSUL_12
Clock Frequency
400 MHz
Write Cycle Time - Word, Page
15ns
Access Time
-
Memory Size
256Mb (16M x 16)
Voltage - Supply
1.14V ~ 1.3V, 1.7V ~ 1.95V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TC)
Package / Case
134-VFBGA
Supplier Device Package
134-VFBGA (10x11.5)
IC DRAM 256MBIT HSUL 12 134VFBGA
Brand Introduction

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

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