TC58CVG1S3HRAIJ

IC FLASH 2GBIT SPI 133MHZ 8WSON
Mfr. Part Number
TC58CVG1S3HRAIJ
Manufacturer
Kioxia America, Inc.
Package / Case
8-WDFN Exposed Pad
Datasheet
Description
IC FLASH 2GBIT SPI 133MHZ 8WSON
RoHS Status
Lead Free / RoHS Complaint
Availability
In Stock — Typically ships within 24 hours after order confirmation
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TC58CVG1S3HRAIJ
Kioxia America, Inc.
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In Stock699
Unit
Price
$5.5385
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Reference Price
QuantityPrice
1$ 5.5385
100$ 4.4308
500$ 3.6923
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-11-04 · Valid as reference until 2026-11-11 · Request RFQ for live stock.
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Specification Summary

Package / Case
8-WDFN Exposed Pad
Supplier Device Package
8-WSON (6x8)
Voltage - Supply
2.7V ~ 3.6V
Clock Frequency
133 MHz
Memory Format
FLASH
Memory Interface
SPI
Memory Size
2Gb (256M x 8)
Memory Type
Non-Volatile
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: In Stock — Typically ships within 24 hours after order confirmation
Final ship date confirmed with payment / PO terms.
Reference price and stock shown as of 2026-11-04. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Memory Type
Non-Volatile
Memory Format
FLASH
Technology
FLASH - NAND (SLC)
Memory Interface
SPI
Clock Frequency
133 MHz
Write Cycle Time - Word, Page
-
Access Time
180 µs
Memory Size
2Gb (256M x 8)
Voltage - Supply
2.7V ~ 3.6V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
8-WDFN Exposed Pad
Supplier Device Package
8-WSON (6x8)
IC FLASH 2GBIT SPI 133MHZ 8WSON
Brand Introduction
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.
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