AT25XE021A-MAHN-T

IC FLASH 2MBIT SPI 70MHZ 8UDFN
Mfr. Part Number
AT25XE021A-MAHN-T
Manufacturer
Adesto Technologies
Package / Case
8-UFDFN Exposed Pad
Datasheet
Description
IC FLASH 2MBIT SPI 70MHZ 8UDFN
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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AT25XE021A-MAHN-T
Adesto Technologies
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In Stock1,907
Unit
Price
$1.45
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Reference Price
QuantityPrice
1$ 1.4500
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-11-08 · Valid as reference until 2026-11-15 · Request RFQ for live stock.
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Specification Summary

Package / Case
8-UFDFN Exposed Pad
Supplier Device Package
8-UDFN (2x3)
Voltage - Supply
1.65V ~ 3.6V
Clock Frequency
70 MHz
Memory Format
FLASH
Memory Interface
SPI
Memory Size
2Mb (256K x 8)
Memory Type
Non-Volatile
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-11-08. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Memory Type
Non-Volatile
Memory Format
FLASH
Technology
FLASH
Memory Interface
SPI
Clock Frequency
70 MHz
Write Cycle Time - Word, Page
8µs, 5ms
Access Time
-
Memory Size
2Mb (256K x 8)
Voltage - Supply
1.65V ~ 3.6V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TC)
Package / Case
8-UFDFN Exposed Pad
Supplier Device Package
8-UDFN (2x3)
IC FLASH 2MBIT SPI 70MHZ 8UDFN
Brand Introduction

Adesto is a leading provider of low power Flash memory, application-specific semiconductors and embedded systems that comprise the essential building blocks of IoT edge devices operating on networks worldwide. Their broad portfolio of non-volatile memory, Analog and digital IP, IoT edge servers, routers, network nodes and communication modules are designed to improve the efficiency and lower the cost of equipment applications in consumer, industrial, communications and medical applications.

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