7200L15TPI

IC MEM FIFO 256X9 15NS 28DIP
Mfr. Part Number
7200L15TPI
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
28-DIP (0.300", 7.62mm)
Datasheet
Description
IC MEM FIFO 256X9 15NS 28DIP
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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7200L15TPI
Intersil (Renesas Electronics Corporation)
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In Stock5,711
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Price
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Reference Price
QuantityPrice
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-22 · Valid as reference until 2026-09-29 · Request RFQ for live stock.
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Specification Summary

Package / Case
28-DIP (0.300", 7.62mm)
Supplier Device Package
28-PDIP
Voltage - Supply
4.5 V ~ 5.5 V
Current - Supply (Max)
80mA
Memory Size
2.25K (256 x 9)
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Access Time
15ns
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-22. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Memory Size
2.25K (256 x 9)
Access Time
15ns
Current - Supply (Max)
80mA
Bus Directional
Uni-Directional
Expansion Type
Depth, Width
Programmable Flags Support
No
Retransmit Capability
Yes
FWFT Support
No
Data Rate
40MHz
Function
Asynchronous
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Supplier Device Package
28-PDIP
IC MEM FIFO 256X9 15NS 28DIP
Brand Introduction
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs.

The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect.

Join Renesas as it strengthens its leading position in the global semiconductor market.
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