S-19932BA-A8T1U7

IC REG BUCK ADJ 600MA HSNT-8(203
Mfr. Part Number
S-19932BA-A8T1U7
Manufacturer
ABLIC
Package / Case
8-SMD, Flat Lead Exposed Pad
Datasheet
Description
IC REG BUCK ADJ 600MA HSNT-8(203
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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S-19932BA-A8T1U7
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In Stock4,547
Unit
Price
$1.9
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Reference Price
QuantityPrice
1$ 1.9000
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-19 · Valid as reference until 2026-09-26 · Request RFQ for live stock.
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Specification Summary

Package / Case
8-SMD, Flat Lead Exposed Pad
Supplier Device Package
HSNT-8-A
Voltage - Input (Max)
18V
Voltage - Input (Min)
4V
Voltage - Output (Max)
12V
Voltage - Output (Min/Fixed)
1V
Current - Output
600mA
Frequency - Switching
2.2MHz
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-19. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Voltage - Input (Min)
4V
Current - Output
600mA
Frequency - Switching
2.2MHz
Number of Outputs
1
Output Configuration
Positive
Synchronous Rectifier
Yes
Topology
Buck
Voltage - Input (Max)
18V
Voltage - Output (Max)
12V
Voltage - Output (Min/Fixed)
1V
Function
Step-Down
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Output Type
Adjustable
Package / Case
8-SMD, Flat Lead Exposed Pad
Supplier Device Package
HSNT-8-A
IC REG BUCK ADJ 600MA HSNT-8(203
Brand Introduction

ABLIC has inherited the Seiko Instruments philosophy of manufacturing. As technology continues to grow and flourish, we aim to create key, world-changing components such as our semiconductor products featuring low-current consumption, low-voltage operation, and ultra-small package technologies, through following the principles of “small, smart, and simple” innovation.

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