XCZU3CG-1SBVA484I

IC SOC CORTEX-A53 484FCBGA
Mfr. Part Number
XCZU3CG-1SBVA484I
Manufacturer
AMD Xilinx
Package / Case
484-BFBGA, FCBGA
Datasheet
Description
IC SOC CORTEX-A53 484FCBGA
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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XCZU3CG-1SBVA484I
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In Stock8,282
Unit
Price
$489.54
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Reference Price
QuantityPrice
1$ 489.5400
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-20 · Valid as reference until 2026-09-27 · Request RFQ for live stock.
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Specification Summary

Package / Case
484-BFBGA, FCBGA
Supplier Device Package
484-FCBGA (19x19)
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Primary Attributes
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-20. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Architecture
MCU, FPGA
Flash Size
-
Primary Attributes
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
RAM Size
256KB
Speed
500MHz, 1.2GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
484-BFBGA, FCBGA
Supplier Device Package
484-FCBGA (19x19)
IC SOC CORTEX-A53 484FCBGA
Brand Introduction

AMD Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. AMD Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.

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