A2F060M3E-1FG256M

IC SOC CORTEX-M3 100MHZ 256FBGA
Mfr. Part Number
A2F060M3E-1FG256M
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Description
IC SOC CORTEX-M3 100MHZ 256FBGA
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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A2F060M3E-1FG256M
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In Stock9,894
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Price
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Reference Price
QuantityPrice
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-22 · Valid as reference until 2026-09-29 · Request RFQ for live stock.
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Specification Summary

Package / Case
256-LBGA
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
-55°C ~ 125°C (TJ)
Architecture
MCU, FPGA
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Core Processor
ARM® Cortex®-M3
Flash Size
128KB
Peripherals
DMA, POR, WDT
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-22. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Architecture
MCU, FPGA
Flash Size
128KB
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
RAM Size
16KB
Speed
100MHz
Operating Temperature
-55°C ~ 125°C (TJ)
Package / Case
256-LBGA
Supplier Device Package
256-FPBGA (17x17)
IC SOC CORTEX-M3 100MHZ 256FBGA
Brand Introduction

Microsemi (Microchip Technology) - Microsemi Corporation was acquired by Microchip in May 2018. Microsemi offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal IC’s, FPGAs, SoCs, ASICs, power management products, timing, voice processing devices, discrete components, enterprise storage, and Power-over-Ethernet solutions.

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