EP4CE30F23C8N

IC FPGA 328 I/O 484FBGA
Mfr. Part Number
EP4CE30F23C8N
Manufacturer
Altera (Intel)
Package / Case
484-BGA
Datasheet
Description
IC FPGA 328 I/O 484FBGA
RoHS Status
Lead Free / RoHS Complaint
Availability
In Stock — Typically ships within 24 hours after order confirmation
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EP4CE30F23C8N
Altera (Intel)
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In Stock780
Unit
Price
$203.5715
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Reference Price
QuantityPrice
1$ 203.5715
100$ 162.8572
500$ 135.7143
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-20 · Valid as reference until 2026-09-27 · Request RFQ for live stock.
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Specification Summary

Package / Case
484-BGA
Supplier Device Package
484-FBGA (23x23)
Voltage - Supply
1.15V ~ 1.25V
Operating Temperature
0°C ~ 85°C (TJ)
Mounting Type
Surface Mount
Number of I/O
328
Number of LABs/CLBs
1803
Number of Logic Elements/Cells
28848
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: In Stock — Typically ships within 24 hours after order confirmation
Final ship date confirmed with payment / PO terms.
Reference price and stock shown as of 2026-09-20. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Number of LABs/CLBs
1803
Number of Logic Elements/Cells
28848
Total RAM Bits
608256
Number of Gates
-
Number of I/O
328
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Voltage - Supply
1.15V ~ 1.25V
Package / Case
484-BGA
Supplier Device Package
484-FBGA (23x23)
IC FPGA 328 I/O 484FBGA
Brand Introduction

Intel and Altera announced on June 1, 2015, that they had entered into a definitive agreement under which Intel would acquire Altera. The transaction closed December 28, 2015. The acquisition couples Intel’s leading-edge products and manufacturing process with Altera’s leading field-programmable gate array (FPGA) technology. The combination enables new classes of products that meet customer needs in the data center and Internet of Things (IoT) market segments.

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