XC6SLX45-N3FGG676I

IC FPGA 358 I/O 676FBGA
Mfr. Part Number
XC6SLX45-N3FGG676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Description
IC FPGA 358 I/O 676FBGA
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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XC6SLX45-N3FGG676I
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In Stock3,731
Unit
Price
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Reference Price
QuantityPrice
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-11-04 · Valid as reference until 2026-11-11 · Request RFQ for live stock.
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Specification Summary

Package / Case
676-BGA
Supplier Device Package
676-FBGA (27x27)
Voltage - Supply
1.14V ~ 1.26V
Operating Temperature
-40°C ~ 100°C (TJ)
Mounting Type
Surface Mount
Number of I/O
358
Number of LABs/CLBs
3411
Number of Logic Elements/Cells
43661
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-11-04. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Number of LABs/CLBs
3411
Number of Logic Elements/Cells
43661
Total RAM Bits
2138112
Number of Gates
-
Number of I/O
358
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Voltage - Supply
1.14V ~ 1.26V
Package / Case
676-BGA
Supplier Device Package
676-FBGA (27x27)
IC FPGA 358 I/O 676FBGA
Brand Introduction

AMD Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. AMD Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.

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