XC2VP30-6FFG1152I

IC FPGA 644 I/O 1152FCBGA
Mfr. Part Number
XC2VP30-6FFG1152I
Manufacturer
AMD Xilinx
Package / Case
1152-BBGA, FCBGA
Datasheet
Description
IC FPGA 644 I/O 1152FCBGA
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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XC2VP30-6FFG1152I
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In Stock2,943
Unit
Price
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Reference Price
QuantityPrice
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-11-04 · Valid as reference until 2026-11-11 · Request RFQ for live stock.
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Specification Summary

Package / Case
1152-BBGA, FCBGA
Supplier Device Package
1152-FCBGA (35x35)
Voltage - Supply
1.425V ~ 1.575V
Operating Temperature
-40°C ~ 100°C (TJ)
Mounting Type
Surface Mount
Number of I/O
644
Number of LABs/CLBs
3424
Number of Logic Elements/Cells
30816
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-11-04. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Number of LABs/CLBs
3424
Number of Logic Elements/Cells
30816
Total RAM Bits
2506752
Number of Gates
-
Number of I/O
644
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Voltage - Supply
1.425V ~ 1.575V
Package / Case
1152-BBGA, FCBGA
Supplier Device Package
1152-FCBGA (35x35)
IC FPGA 644 I/O 1152FCBGA
Brand Introduction

AMD Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. AMD Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.

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