BSS8402DW-7

MOSFET N/P-CH 60V/50V SC70-6
Mfr. Part Number
BSS8402DW-7
Manufacturer
Diodes Incorporated
Package / Case
6-TSSOP, SC-88, SOT-363
Datasheet
Description
MOSFET N/P-CH 60V/50V SC70-6
RoHS Status
Lead Free / RoHS Complaint
Availability
In Stock — Typically ships within 24 hours after order confirmation
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BSS8402DW-7
Diodes Incorporated
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In Stock100,000
Unit
Price
$0.688
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Reference Price
QuantityPrice
1$ 0.6880
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-19 · Valid as reference until 2026-09-26 · Request RFQ for live stock.
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Specification Summary

Package / Case
6-TSSOP, SC-88, SOT-363
Supplier Device Package
SOT-363
Drain to Source Voltage (Vdss)
60V, 50V
Current - Continuous Drain (Id) @ 25°C
115mA, 130mA
Operating Temperature
-55°C ~ 150°C (TJ)
Mounting Type
Surface Mount
FET Feature
Logic Level Gate
FET Type
N and P-Channel
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: In Stock — Typically ships within 24 hours after order confirmation
Final ship date confirmed with payment / PO terms.
Reference price and stock shown as of 2026-09-19. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 150°C (TJ)
Current - Continuous Drain (Id) @ 25°C
115mA, 130mA
Drain to Source Voltage (Vdss)
60V, 50V
FET Feature
Logic Level Gate
FET Type
N and P-Channel
Gate Charge (Qg) (Max) @ Vgs
-
Input Capacitance (Ciss) (Max) @ Vds
50pF @ 25V
Rds On (Max) @ Id, Vgs
7.5Ohm @ 50mA, 5V
Vgs(th) (Max) @ Id
2.5V @ 250µA
Power - Max
200mW
Supplier Device Package
SOT-363
Package / Case
6-TSSOP, SC-88, SOT-363
MOSFET N/P-CH 60V/50V SC70-6
Brand Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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