System On Chip (SoC)
Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.
Sourcing Microsemi System On Chip (SoC): in-stock lines for quick ship, BOM matching for multi-line builds, and original-channel screening — not keyword stuffing.
Product List
Total Components: 66
| Product | Pricing | Datasheet | Architecture | Flash Size | Primary Attributes | Connectivity | Core Processor | Peripherals | RAM Size | Speed | Operating Temperature | Package / Case | Supplier Device Package | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A2F060M3E-1TQ144I Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 100MHz | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 1,105 | ||
A2F060M3E-1TQG144I Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 100MHz | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 6,901 | ||
A2F060M3E-1TQG144 Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 100MHz | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 3,188 | ||
A2F060M3E-TQG144 Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 80MHz | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 8,404 | ||
A2F060M3E-TQ144 Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 80MHz | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 6,152 | ||
A2F060M3E-TQG144I Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 80MHz | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 4,547 | ||
A2F060M3E-1TQ144 Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 100MHz | 0°C ~ 85°C (TJ) | 144-LQFP | 144-TQFP (20x20) | 3,279 | ||
 M2S100TS-1FC1152I Microsemi | MCU, FPGA | 512KB | FPGA - 100K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 8,917 | ||
M2S100TS-1FCG1152I Microsemi | MCU, FPGA | 512KB | FPGA - 100K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 9,412 | ||
M2S150S-1FCG1152I Microsemi | MCU, FPGA | 512KB | FPGA - 150K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 1,309 | ||
 M2S050S-1FGG896I Microsemi | MCU, FPGA | 256KB | FPGA - 50K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 896-BGA | 896-FBGA (31x31) | 4,309 | ||
M2S090S-1FGG676I Microsemi | MCU, FPGA | 512KB | FPGA - 90K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 676-BGA | 676-FBGA (27x27) | 7,618 | ||
M2S100-1FCG1152 Microsemi | MCU, FPGA | 512KB | FPGA - 100K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 6,165 | ||
M2S100-1FCG1152I Microsemi | MCU, FPGA | 512KB | FPGA - 100K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 6,971 | ||
M2S150S-1FC1152I Microsemi | MCU, FPGA | 512KB | FPGA - 150K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 6,361 | ||
 A2F060M3E-1FG256M Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 100MHz | -55°C ~ 125°C (TJ) | 256-LBGA | 256-FPBGA (17x17) | 9,894 | ||
A2F060M3E-1FGG256M Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 100MHz | -55°C ~ 125°C (TJ) | 256-LBGA | 256-FPBGA (17x17) | 2,385 | ||
A2F060M3E-FG256M Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 80MHz | -55°C ~ 125°C (TJ) | 256-LBGA | 256-FPBGA (17x17) | 8,243 | ||
A2F060M3E-FGG256M Microsemi | MCU, FPGA | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | EBI/EMI, I²C, SPI, UART/USART | ARM® Cortex®-M3 | DMA, POR, WDT | 16KB | 80MHz | -55°C ~ 125°C (TJ) | 256-LBGA | 256-FPBGA (17x17) | 6,059 | ||
M2S090-1FG676IX417 Microsemi | MCU, FPGA | 512KB | FPGA - 90K Logic Modules | CANbus, Ethernet, I²C, SPI, UART/USART, USB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 64KB | 166MHz | -40°C ~ 100°C (TJ) | 676-BGA | 676-FBGA (27x27) | 1,649 |