IJ5H-08-0610-S-2-01SP1

CBL ASSY 50 OHM 4MM
Mfr. Part Number
IJ5H-08-0610-S-2-01SP1
Manufacturer
Samtec, Inc.
Datasheet
Description
CBL ASSY 50 OHM 4MM
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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IJ5H-08-0610-S-2-01SP1
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In Stock1,480
Unit
Price
$127.54
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Reference Price
QuantityPrice
1$ 127.5400
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-11-05 · Valid as reference until 2026-11-12 · Request RFQ for live stock.
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Specification Summary

Frequency - Max
9.5 GHz
Operating Temperature
-40°C ~ 90°C
1st Connector Mounting Feature
Latch Lock
1st Connector Mounting Type
Panel Mount
2nd Connector Mounting Type
Free Hanging (In-Line)
1st Connector
IJ5H Plug
1st Contact Gender
Male
2nd Connector
SMA Plug (8)
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-11-05. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
1st Contact Gender
Male
1st Connector Mounting Feature
Latch Lock
2nd Contact Gender
Male
2nd Connector Mounting Feature
-
Cable Impedance
50 Ohms
Connector Impedance
-
Overall Impedance
50 Ohms
Frequency - Max
9.5 GHz
1st Connector Mounting Type
Panel Mount
2nd Connector Mounting Type
Free Hanging (In-Line)
Color
Copper
Features
Shielded
Operating Temperature
-40°C ~ 90°C
1st Connector
IJ5H Plug
2nd Connector
SMA Plug (8)
Cable Type
RG-316
Ingress Protection
-
Length
24.00" (609.60mm)
Style
IJ5H to SMA
CBL ASSY 50 OHM 4MM
Brand Introduction

Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).

To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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