STM32WB55RGV6

ULTRA-LOW-POWER DUAL CORE ARM CO
Mfr. Part Number
STM32WB55RGV6
Manufacturer
STMicroelectronics
Package / Case
68-VFQFN Exposed Pad
Datasheet
Description
ULTRA-LOW-POWER DUAL CORE ARM CO
RoHS Status
Lead Free / RoHS Complaint
Availability
In Stock — Typically ships within 24 hours after order confirmation
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STM32WB55RGV6
STMicroelectronics
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In Stock100
Unit
Price
$4.65
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Reference Price
QuantityPrice
1$ 4.6500
100$ 3.7200
500$ 3.1000
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-10-29 · Valid as reference until 2026-11-05 · Request RFQ for live stock.
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Specification Summary

Package / Case
68-VFQFN Exposed Pad
Supplier Device Package
68-VFQFPN (8x8)
Voltage - Supply
1.71V ~ 3.6V
Current - Receiving
3.8mA ~ 7mA
Current - Transmitting
8.1mA ~ 13.1mA
Frequency
2.405GHz ~ 2.48GHz
Memory Size
1MB Flash, 256kB SRAM
Operating Temperature
-40°C ~ 85°C (TA)
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: In Stock — Typically ships within 24 hours after order confirmation
Final ship date confirmed with payment / PO terms.
Reference price and stock shown as of 2026-10-29. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
GPIO
49
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Type
TxRx + MCU
Current - Receiving
3.8mA ~ 7mA
Current - Transmitting
8.1mA ~ 13.1mA
Data Rate (Max)
2Mbps
Modulation
GFSK
Power - Output
6dBm
Protocol
Bluetooth v5.2, Thread, Zigbee®
RF Family/Standard
802.15.4, Bluetooth
Serial Interfaces
ADC, I²C, SPI, UART, USART, USB
Frequency
2.405GHz ~ 2.48GHz
Memory Size
1MB Flash, 256kB SRAM
Package / Case
68-VFQFN Exposed Pad
Sensitivity
-100dBm
Supplier Device Package
68-VFQFPN (8x8)
Voltage - Supply
1.71V ~ 3.6V
ULTRA-LOW-POWER DUAL CORE ARM CO
Brand Introduction
STMicroelectronics is a global independent semiconductor company and is a leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivaled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence trends.
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