We source brand-new parts via original manufacturers, franchised distributors or verified independent channels, with incoming inspection. Channel type is confirmed on your quote.
Contact sales or email [email protected] with MPN and quantity. We reply with stock, ETA and reference pricing — confirm before PO.
Reference price and stock shown as of 2026-09-19. Confirm live availability and unit price via RFQ before placing a PO.
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Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).
Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Now covering nearly all phases of semiconductor packaging, electronics assembly, thermal management and structural assembly, Henkel is unmatched in its ability to provide top electronics companies with comprehensive material solutions.