Mfr. Part Number
TLP5214A(D4-TP,E
Manufacturer
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
Package / Case
16-SOIC (0.295", 7.50mm Width)
Datasheet
Description
OPTOCOUPLER IGBT 4A 110C OPR TEM
RoHS Status
Lead Free / RoHS Complaint
Availability
In Stock — Typically ships within 24 hours after order confirmation
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TLP5214A(D4-TP,E
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
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In Stock100,000
Unit
Price
$16.0
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Reference Price
QuantityPrice
1$ 16.0000
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-11-04 · Valid as reference until 2026-11-11 · Request RFQ for live stock.
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Specification Summary

Package / Case
16-SOIC (0.295", 7.50mm Width)
Supplier Device Package
16-SO
Voltage - Forward (Vf) (Typ)
1.7V (Max)
Voltage - Isolation
5000Vrms
Voltage - Output Supply
15V ~ 30V
Current - DC Forward (If) (Max)
25 mA
Current - Output High, Low
3A, 3A
Current - Peak Output
4A
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: In Stock — Typically ships within 24 hours after order confirmation
Final ship date confirmed with payment / PO terms.
Reference price and stock shown as of 2026-11-04. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Current - Output High, Low
3A, 3A
Current - Peak Output
4A
Voltage - Output Supply
15V ~ 30V
Common Mode Transient Immunity (Min)
35kV/µs
Propagation Delay tpLH / tpHL (Max)
150ns, 150ns
Pulse Width Distortion (Max)
50ns
Rise / Fall Time (Typ)
32ns, 18ns
Approval Agency
-
Current - DC Forward (If) (Max)
25 mA
Technology
Optical Coupling
Voltage - Forward (Vf) (Typ)
1.7V (Max)
Mounting Type
Surface Mount
Number of Channels
1
Operating Temperature
-40°C ~ 110°C
Package / Case
16-SOIC (0.295", 7.50mm Width)
Supplier Device Package
16-SO
Voltage - Isolation
5000Vrms
OPTOCOUPLER IGBT 4A 110C OPR TEM
Brand Introduction

Toshiba Electronic Devices and Storage Corporation offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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