Mfr. Part Number
TPH3R003PL,LQ
Manufacturer
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
Package / Case
8-PowerVDFN
Datasheet
Description
MOSFET N-CH 30V 88A 8SOP
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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TPH3R003PL,LQ
TAEC Product (Toshiba Electronic Devices and Storage Corporation)
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In Stock8,247
Unit
Price
$1.02
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Reference Price
QuantityPrice
1$ 1.0200
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-20 · Valid as reference until 2026-09-27 · Request RFQ for live stock.
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Specification Summary

Package / Case
8-PowerVDFN
Supplier Device Package
8-SOP Advance (5x5)
Drain to Source Voltage (Vdss)
30 V
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Current - Continuous Drain (Id) @ 25°C
88A (Tc)
Operating Temperature
175°C (TJ)
Mounting Type
Surface Mount
FET Type
N-Channel
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-20. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Vgs (Max)
±20V
Mounting Type
Surface Mount
Operating Temperature
175°C (TJ)
Current - Continuous Drain (Id) @ 25°C
88A (Tc)
Drain to Source Voltage (Vdss)
30 V
FET Feature
-
FET Type
N-Channel
Gate Charge (Qg) (Max) @ Vgs
50 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds
3825 pF @ 15 V
Power Dissipation (Max)
90W (Tc)
Rds On (Max) @ Id, Vgs
4.2mOhm @ 44A, 4.5V
Vgs(th) (Max) @ Id
2.1V @ 300µA
Supplier Device Package
8-SOP Advance (5x5)
Technology
MOSFET (Metal Oxide)
Package / Case
8-PowerVDFN
MOSFET N-CH 30V 88A 8SOP
Brand Introduction

Toshiba Electronic Devices and Storage Corporation offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chip companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets.

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