MADP-000165-01340W

RF DIODE PIN 200V DIE
Mfr. Part Number
MADP-000165-01340W
Manufacturer
MACOM Technology Solutions
Package / Case
Die
Datasheet
Description
RF DIODE PIN 200V DIE
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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MADP-000165-01340W
MACOM Technology Solutions
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In Stock7,875
Unit
Price
$1.875
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Reference Price
QuantityPrice
1$ 1.8750
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-20 · Valid as reference until 2026-09-27 · Request RFQ for live stock.
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Specification Summary

Package / Case
Die
Supplier Device Package
Die
Voltage - Peak Reverse (Max)
200V
Operating Temperature
175°C (TJ)
Capacitance @ Vr, F
0.06pF @ 10V, 1MHz
Diode Type
PIN - Single
Resistance @ If, F
2.5Ohm @ 10mA, 500MHz
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-20. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Current - Max
-
Resistance @ If, F
2.5Ohm @ 10mA, 500MHz
Operating Temperature
175°C (TJ)
Capacitance @ Vr, F
0.06pF @ 10V, 1MHz
Diode Type
PIN - Single
Power Dissipation (Max)
-
Voltage - Peak Reverse (Max)
200V
Supplier Device Package
Die
Package / Case
Die
RF DIODE PIN 200V DIE
Brand Introduction

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia.

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