ZW-20-09-S-D-410-230

CONN BRD STACK .100" 40POS
Mfr. Part Number
ZW-20-09-S-D-410-230
Manufacturer
Samtec, Inc.
Datasheet
Description
CONN BRD STACK .100" 40POS
RoHS Status
Lead Free / RoHS Complaint
Availability
Sourcing — Lead time quoted on request (often 3–15 business days by channel)
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ZW-20-09-S-D-410-230
Samtec, Inc.
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In Stock5,868
Unit
Price
$10.43
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Reference Price
QuantityPrice
1$ 10.4300
Prices are for reference only. The final transaction is subject to confirmation.
As of 2026-09-19 · Valid as reference until 2026-09-26 · Request RFQ for live stock.
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Specification Summary

Mounting Type
Through Hole
Color
Black
Contact Finish - Post (Mating)
Gold
Contact Finish Thickness - Post (Mating)
30.0µin (0.76µm)
Length - Overall Pin
0.730" (18.542mm)
Length - Post (Mating)
0.090" (2.286mm)
Length - Stack Height
0.410" (10.414mm)
Length - Tail
0.230" (5.842mm)
Full specifications are listed below. Need alternates or BOM matching? Read BOM guide · Request a quote
Stock status: Sourcing — Lead time quoted on request (often 3–15 business days by channel)
Shortage / allocation / EOL lines may need longer — ask via RFQ.
Reference price and stock shown as of 2026-09-19. Confirm live availability and unit price via RFQ before placing a PO.
Specifications
Product Description
Purchase & Inquiry
Length - Overall Pin
0.730" (18.542mm)
Length - Post (Mating)
0.090" (2.286mm)
Length - Stack Height
0.410" (10.414mm)
Length - Tail
0.230" (5.842mm)
Contact Finish - Post (Mating)
Gold
Contact Finish Thickness - Post (Mating)
30.0µin (0.76µm)
Color
Black
Mounting Type
Through Hole
Number of Positions
40
Number of Rows
2
Pitch
0.100" (2.54mm)
Row Spacing
0.100" (2.54mm)
Termination
Solder
CONN BRD STACK .100" 40POS
Brand Introduction

Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).

To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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