
Adapter, Breakout Boards
Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.
Sourcing Dreyer Electronics LLC Adapter, Breakout Boards: in-stock lines for quick ship, BOM matching for multi-line builds, and original-channel screening — not keyword stuffing.
Product List
Total Components: 4
| Product | Pricing | Datasheet | Package Accepted | Number of Positions | Material | Size / Dimension | Board Thickness | Proto Board Type | Pitch | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|
![]() DE0303 Dreyer Electronics LLC | 1 $0.4500 | SOT-23, SOT-363 | 6 | FR4 Epoxy Glass | - | 0.063" (1.60mm) | SMD to DIP | 0.100" (2.54mm) | 8,490 | |
![]() DE01064 Dreyer Electronics LLC | 1 $1.5000 | LQFP, QFP, TQFP | 64 | FR4 Epoxy Glass | - | 0.063" (1.60mm) | SMD to DIP | 0.100" (2.54mm) | 3,287 | |
![]() DE01044 Dreyer Electronics LLC | 1 $1.5000 | LQFP, QFP, TQFP | 44 | FR4 Epoxy Glass | 2.236" L x 0.937" W (56.80mm x 23.80mm) | 0.063" (1.60mm) | SMD to DIP | 0.100" (2.54mm) | 7,965 | |
![]() DE02014 Dreyer Electronics LLC | 1 $1.0000 | SOIC, SOP, SSOP | 14 | FR4 Epoxy Glass | 0.740" L x 0.744" W (18.80mm x 18.90mm) | 0.063" (1.60mm) | SMD to DIP | 0.100" (2.54mm) | 1,965 |



