Power Driver Modules
Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
Sourcing GeneSiC Semiconductor Power Driver Modules: in-stock lines for quick ship, BOM matching for multi-line builds, and original-channel screening — not keyword stuffing.
Product List
Total Components: 4
| Product | Pricing | Datasheet | Type | Current | Voltage - Isolation | Mounting Type | Configuration | Voltage | Package / Case | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|
 GA10SICP12-247 GeneSiC Semiconductor | - | 10 A | - | Through Hole | - | 1.2 kV | TO-247-3 | 4,834 | ||
GA50SICP12-227 GeneSiC Semiconductor | - | 50 A | - | Chassis Mount | - | 1.2 kV | SOT-227-4, miniBLOC | 4,994 | ||
GA100SICP12-227 GeneSiC Semiconductor | - | 100 A | - | Chassis Mount | - | 1.2 kV | SOT-227-4, miniBLOC | 9,468 | ||
GA20SICP12-263 GeneSiC Semiconductor | 1 $56.3100 | - | 20 A | - | Surface Mount | - | 1.2 kV | TO-263-8, D²Pak (7 Leads + Tab), TO-263CA | 5,668 |