Power Driver Modules
Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
Sourcing Microchip Technology Power Driver Modules: in-stock lines for quick ship, BOM matching for multi-line builds, and original-channel screening — not keyword stuffing.
Product List
Total Components: 7
| Product | Pricing | Datasheet | Type | Current | Voltage - Isolation | Mounting Type | Configuration | Voltage | Package / Case | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|
 APTLGF350A608G Microchip Technology | IGBT | 430 A | 2500Vrms | Through Hole | Half Bridge | 600 V | 6-PowerSIP Module | 8,488 | ||
MSCSM120SKM11CT3AG Microchip Technology | 1 $268.4800 | MOSFET | 254 A | 4000Vrms | Chassis Mount | 1 Phase | 1.2 kV | Module | 7,001 | |
MSCSM70TAM05TPAG Microchip Technology | 1 $905.1800 | MOSFET | 273 A | - | Chassis Mount | 3 Phase Inverter | 700 V | Module | 5,180 | |
MSCSM120DAM11CT3AG Microchip Technology | 1 $268.4800 | MOSFET | 254 A | 4000Vrms | Chassis Mount | 1 Phase | 1.2 kV | Module | 5,556 | |
APTLGT400A608G Microchip Technology | 1 $521.9433 | IGBT | 600 A | 2500Vrms | Through Hole | Half Bridge | 600 V | 6-PowerSIP Module | 3,998 | |
APTLGL325A1208G Microchip Technology | 1 $585.9067 | IGBT | 420 A | 2500Vrms | Through Hole | Half Bridge | 1.2 kV | 6-PowerSIP Module | 7,442 | |
APTLGT300A1208G Microchip Technology | 1 $600.1933 | IGBT | 440 A | 2500Vrms | Through Hole | Half Bridge | 1.2 kV | 6-PowerSIP Module | 2,347 |