Connectors, Interconnects
Connector and interconnect products facilitate the joining of electrical or fiber optic conductors & cables. An enormous variety of styles are available, to accommodate most any application; banana plugs for lab equipment, coaxial connectors for RF, modular plugs for network and phone systems, spade and ring terminals for connecting discrete wires to terminal blocks, terminal blocks, sockets for transistors and integrated circuits, standard AC power connectors, headphone plugs and jacks, high-voltage connectors, USB connectors, and many, many more.
Sourcing 3M Connectors, Interconnects: in-stock lines for quick ship, BOM matching for multi-line builds, and original-channel screening — not keyword stuffing.
Product List
Total Components: 13
| Product | Pricing | Datasheet | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | Operating Temperature | Pitch - Post | Contact Finish - Mating | Contact Finish - Post | Features | Housing Material | Mounting Type | Pitch - Mating | Termination | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 4808-3004-CP 3M | 1 $0.6300 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 35.4µin (0.90µm) | Phosphor Bronze | 35.0µin (0.90µm) | Phosphor Bronze | -25°C ~ 85°C | 0.100" (2.54mm) | Tin | Tin | Open Frame | Polyester, Glass Filled | Through Hole | 0.100" (2.54mm) | Solder | 3,389 | |
 8432-21B1-RK-TR 3M | 1 $2.1400 | PLCC | 32 (2 x 7, 2 x 9) | 160.0µin (4.06µm) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | -40°C ~ 105°C | 0.050" (1.27mm) | Tin | Tin | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Surface Mount | 0.050" (1.27mm) | Solder | 8,322 | |
 8444-21B1-RK-TR 3M | 1 $2.5600 | PLCC | 44 (4 x 11) | 160.0µin (4.06µm) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | -40°C ~ 105°C | 0.050" (1.27mm) | Tin | Tin | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Surface Mount | 0.050" (1.27mm) | Solder | 8,838 | |
 8444-11B1-RK-TP 3M | 1 $2.1100 | PLCC | 44 (4 x 11) | 160.0µin (4.06µm) | Copper Alloy | 160.0µin (4.06µm) | Copper Alloy | -40°C ~ 105°C | 0.100" (2.54mm) | Tin | Tin | Closed Frame | Polybutylene Terephthalate (PBT), Glass Filled | Through Hole | 0.050" (1.27mm) | Solder | 2,264 | |
 214-3339-00-0602J 3M | 1 $20.9500 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 125°C | 0.100" (2.54mm) | Gold | Gold | Closed Frame | Polysulfone (PSU), Glass Filled | Connector | 0.100" (2.54mm) | Press-Fit | 8,513 | |
 224-1275-00-0602J 3M | 1 $22.5100 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 125°C | 0.100" (2.54mm) | Gold | Gold | Closed Frame | Polysulfone (PSU), Glass Filled | Connector | 0.100" (2.54mm) | Press-Fit | 1,571 | |
 220-3342-00-0602J 3M | 1 $22.2800 | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 125°C | 0.100" (2.54mm) | Gold | Gold | Closed Frame | Polysulfone (PSU), Glass Filled | Connector | 0.100" (2.54mm) | Press-Fit | 9,355 | |
 208-7391-55-1902 3M | 1 $33.6500 | SOIC | 8 (2 x 4) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 150°C | - | Gold | Gold | Closed Frame | Polyethersulfone (PES), Glass Filled | Through Hole | - | Solder | 1,196 | |
 248-1282-00-0602J 3M | 1 $36.4900 | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 125°C | 0.100" (2.54mm) | Gold | Gold | Closed Frame | Polysulfone (PSU), Glass Filled | Connector | 0.100" (2.54mm) | Press-Fit | 8,238 | |
 216-7224-55-1902 3M | 1 $37.4500 | SOIC | 16 (2 x 8) | - | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 150°C | - | Gold | Gold | Closed Frame | Polyethersulfone (PES), Glass Filled | Through Hole | - | Solder | 4,196 | |
 203-2737-55-1102 3M | 1 $44.2800 | Transistor, TO-3 and TO-66 | 3 (Rectangular) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 150°C | 0.234" (5.94mm) | Gold | Gold | Closed Frame | Polyphenylene Sulfide (PPS), Glass Filled | Through Hole | - | Solder | 4,265 | |
 210-2599-00-0602 3M | 1 $45.4300 | SIP, ZIF (ZIP) | 10 (1 x 10) | 30.0µin (0.76µm) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 125°C | 0.100" (2.54mm) | Gold | Gold | - | Polysulfone (PSU), Glass Filled | Through Hole | 0.100" (2.54mm) | Solder | 7,741 | |
 220-2600-00-0602 3M | 1 $47.5400 | SIP, ZIF (ZIP) | 20 (1 x 20) | - | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | -55°C ~ 125°C | 0.100" (2.54mm) | Gold | Gold | - | Polysulfone (PSU), Glass Filled | Through Hole | 0.100" (2.54mm) | Solder | 6,910 |