
Connectors, Interconnects
Connector and interconnect products facilitate the joining of electrical or fiber optic conductors & cables. An enormous variety of styles are available, to accommodate most any application; banana plugs for lab equipment, coaxial connectors for RF, modular plugs for network and phone systems, spade and ring terminals for connecting discrete wires to terminal blocks, terminal blocks, sockets for transistors and integrated circuits, standard AC power connectors, headphone plugs and jacks, high-voltage connectors, USB connectors, and many, many more.
Sourcing Aries Electronics, Inc. Connectors, Interconnects: in-stock lines for quick ship, BOM matching for multi-line builds, and original-channel screening — not keyword stuffing.
Product List
Total Components: 10
| Product | Pricing | Datasheet | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | Operating Temperature | Pitch - Post | Contact Finish - Mating | Contact Finish - Post | Features | Housing Material | Mounting Type | Pitch - Mating | Termination | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() 08-0518-10 Aries Electronics, Inc. | 1 $1.2600 | SIP | 8 (1 x 8) | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | - | 0.100" (2.54mm) | Gold | Tin | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 0.100" (2.54mm) | Solder | 6,010 | |
![]() 08-3518-00 Aries Electronics, Inc. | 1 $1.6400 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | - | 0.100" (2.54mm) | Gold | Tin | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Surface Mount | 0.100" (2.54mm) | Solder | 9,178 | |
![]() 25-0513-10 Aries Electronics, Inc. | 1 $4.5200 | SIP | 25 (1 x 25) | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | - | 0.100" (2.54mm) | Gold | Tin | - | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 0.100" (2.54mm) | Solder | 1,133 | |
![]() 40-0518-10 Aries Electronics, Inc. | 1 $4.8000 | SIP | 40 (1 x 40) | 10.0µin (0.25µm) | Beryllium Copper | 200.0µin (5.08µm) | Brass | - | 0.100" (2.54mm) | Gold | Tin | Open Frame | Polyamide (PA46), Nylon 4/6, Glass Filled | Through Hole | 0.100" (2.54mm) | Solder | 3,756 | |
![]() 10-2810-90 Aries Electronics, Inc. | 1 $9.8500 | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 10.0µin (0.25µm) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | - | 0.100" (2.54mm) | Gold | Gold | Closed Frame | Polyamide (PA46), Nylon 4/6 | Through Hole, Right Angle, Vertical | 0.100" (2.54mm) | Solder | 2,049 | |
![]() 169-PRS13001-12 Aries Electronics, Inc. | 1 $94.5000 | PGA, ZIF (ZIP) | - | 30.0µin (0.76µm) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | -65°C ~ 125°C | 0.100" (2.54mm) | Gold | Tin | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 0.100" (2.54mm) | Solder | 1,327 | |
![]() 225-PRS15001-12 Aries Electronics, Inc. | 1 $104.9600 | PGA, ZIF (ZIP) | 225 (15 x 15) | 30.0µin (0.76µm) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | -65°C ~ 125°C | 0.100" (2.54mm) | Gold | Tin | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 0.100" (2.54mm) | Solder | 2,904 | |
![]() 289-PRS17001-12 Aries Electronics, Inc. | 1 $122.6100 | PGA, ZIF (ZIP) | - | 30.0µin (0.76µm) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | -65°C ~ 125°C | 0.100" (2.54mm) | Gold | Tin | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 0.100" (2.54mm) | Solder | 9,543 | |
![]() 361-PRS19001-12 Aries Electronics, Inc. | 1 $142.6500 | PGA, ZIF (ZIP) | - | 30.0µin (0.76µm) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | -65°C ~ 125°C | 0.100" (2.54mm) | Gold | Tin | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 0.100" (2.54mm) | Solder | 2,000 | |
![]() 441-PRS21001-12 Aries Electronics, Inc. | 1 $164.9700 | PGA, ZIF (ZIP) | - | 30.0µin (0.76µm) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | -65°C ~ 125°C | 0.100" (2.54mm) | Gold | Tin | Closed Frame | Polyphenylene Sulfide (PPS) | Through Hole | 0.100" (2.54mm) | Solder | 7,371 |









